Since it’s founding in 1987, TesTex Inc. has been focused on the Research & Development of high-end NDT methods primarily in Electromagnetics. The first application development project was for Bettis Atomic Labs (for the United States Nuclear Navy). The task was to develop an inspection technology for magnetic Heat Exchanger Tubes that could detect and quantify wall thinning as well as pitting without using a secondary inspection method. For this application, TesTex developed the Remote Field Electromagnetic Technique (RFET). This was the first tubing inspection system to use a portable computer for data display and analysis as opposed to using a paper strip chart. Through out the 1990’s, TesTex continued to develop the RFET technologies with input from various industries such as Refining, Chemical/PetroChemical, Power, Pulp & Paper, and Steel. This yielded the most advanced RFET technology available today, which is called TesTex Multi-Channel RFET.

In 1992, TesTex developed the Low Frequency Electromagnetic Technique (LFET) for the inspection of Above Ground Storage Tanks (AGSTs). The LFET technology developed into several product lines and applications for TesTex including Pipeline and Pressure Vessel Scanning, Boiler Waterwall / Superheater / Reheater Scanning, and Large Diameter Piping Inspections from the Inner Diameter.

The latest development from TesTex is in Crack Detection using what is called Balanced Field Technique to detect surface and sub-surface cracking in magnetic and non-magnetic metals. While the current TesTex Hawkeye Crack Detection Systems that are field deployed can detect a crack within 3mm of the surface, new prototype sensors are detecting cracks within 6mm of the surface.

Whether through our own feedback loops from our Field Service Group, or from direct input from industrial clients or trade groups, TesTex continues to conduct consistent Research & Development. We have a full time staff spanning areas of expertise in Digital Design, Mechanical Innovation, Software Programming, System Integration, and Sensor Development. TesTex will always utilize the latest in Digital Signal Processing Chips (DSP), Field Programmable Gate Arrays (FPGA), Software Algorithms, and Automation in order to put forth the most capable systems for Electromagnetic NDE.